By Basil E
•Feb 6, 2024
This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.
By 2023 1
•Mar 10, 2024
Good and Informative Course!
By Sachin P
•Sep 21, 2024
very good
By Perez C J
•Nov 1, 2024
excelent
By 민건희
•May 15, 2024
Good.
By Swetha r G
•Sep 11, 2024
good
By Ranganath K
•Mar 29, 2024
Very well deliverd and extremely pleased with the contents
By 01fe20bec164
•Oct 18, 2024
-
By Boyi F
•Nov 15, 2023
I hope this class can provide more detailed introduction of advanced packaging techniques, such CoWoS, EMIB, CPO....
By lucas n
•Sep 19, 2024
As a pioneer in the industry, Intel should share more detailed materials or case studies, especially considering the advancements and maturity of packaging, assembly, and testing since Moore's era.