BE
5.0Reviewed Feb 5, 2024
This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.
Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for 7-nanometer silicon feature sizes and beyond. The course will present the evolution and impact of packaging on product performance and innovation. Specifically, we highlight how packaging has enabled better products via the use of heterogeneous integration by improving the interconnects for thermal management and signal integrity.